Author:
Jeong Daekyun,Abdur Rahim,Joo Young-Chang,Jang Jae-il,Cha Pil Ryung,Kim Jiyoung,Min Kyeong-Sik,Lee Jaegab
Funder
Ministry of Science, ICT and Future Planning
National Research Foundation of Korea (NRF)
Industrial Strategic Technology Development Program
Ministry of Knowledge Economy
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference69 articles.
1. Interconnect, The International Technology Roadmap for Semiconductors, 2013. 〈http://www.itrs2. net/itrs-reports.html〉.
2. A review of 3-D packaging technology;Al-sarawi;IEEE Trans. Compon. Pack. B,1998
3. New through-wafer via interconnections with thick oxidized porous silicon sidewall via;Kim;Jpn. J. Appl. Phys.,2006
4. Nonlinear thermal stress/strainanalysis of copper filled TSV (Through Silicon Via) and their Flip-chip microbumps;Selvanayagam;IEEE Trans. Adv. Packag.,2009
5. Through-Silicon Via (TSV);Motoyoshi;Proc. IEEE,2009
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献