Enhanced Interfacial Adhesion and Thermal Stability in Bismuth Telluride/Nickel/Copper Multilayer Films with Low Electrical Contact Resistance
Author:
Affiliation:
1. School of Materials Science and EngineeringBeihang University No. 37 Xueyuan Road Beijing 100083 China
2. Beijing Advanced Innovation Center for Biomedical EngineeringBeihang University Beijing 100083 China
Funder
National Natural Science Foundation of China
Natural Science Foundation of Beijing Municipality
Publisher
Wiley
Subject
Mechanical Engineering,Mechanics of Materials
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/admi.201801279
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