A review of ultra-short pulse laser micromachining of wide bandgap semiconductor materials: SiC and GaN
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Elsevier BV
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1. Nanosecond laser irradiation assisted chemical mechanical polishing (CMP) process for promoting material removal of single crystal 4H–SiC;Ceramics International;2024-10
2. Molecular dynamics simulations in semiconductor material processing: A comprehensive review;Measurement;2024-09
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