Characterization and control of laser induced modification inside silicon-Reference-Cited by-同舟云学术

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Characterization and control of laser induced modification inside silicon

Published:2019-05 Issue:2 Volume:31 Page:022601
ISSN:1042-346X
Container-title:Journal of Laser Applications
language:en
Short-container-title:Journal of Laser Applications

Author:

Wang Xinya¹,Yu Xiaoming²,Shi Hongyu³,Tian Xianhua⁴,Chambonneau Maxime⁵,Grojo David⁵,DePaola Brett³,Berg Matthew³,Lei Shuting¹

Affiliation:

1. Department of Industrial and Manufacturing Systems Engineering, Kansas State University, Manhattan, Kansas 66506

2. The College of Optics and Photonics, University of Central Florida, Orlando, Florida 32816

3. Department of Physics, Kansas State University, Manhattan, Kansas 66506

4. School of Mechatronic Engineering, China University of Mining and Technology, Xuzhou 221116, People’s Republic of China

5. Aix-Marseille University, CNRS, LP3 UMR 7341, F-13288 Marseille, France

Publisher

Laser Institute of America

Subject

Instrumentation,Biomedical Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://lia.scitation.org/doi/pdf/10.2351/1.5096086

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1. A review of ultra-short pulse laser micromachining of wide bandgap semiconductor materials: SiC and GaN;Materials Science in Semiconductor Processing;2024-09

2. Morphology Characterization and Refractive Index Analysis of Subsurface Ultrashort‐Pulsed Laser Modifications in ZnS;physica status solidi (a);2024-07-23

3. Transverse Inscription of Silicon Waveguides by Picosecond Laser Pulses;Laser & Photonics Reviews;2024-07-09

4. The influence of cracks in the coupling region of micro-grinding and laser stealth combined dicing on the quality of cutting side walls;Journal of Manufacturing Processes;2024-06

5. Direct observation and quantification of nanosecond laser induced amorphization inside silicon;Journal of Laser Applications;2024-03-27

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