Prediction of interfacial adhesion strength of nanoscale Al/TiN films passed through patterned BEOL interconnects-Reference-Cited by-同舟云学术

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Prediction of interfacial adhesion strength of nanoscale Al/TiN films passed through patterned BEOL interconnects

Published:2015-11 Issue: Volume:39 Page:1-5
ISSN:1369-8001
Container-title:Materials Science in Semiconductor Processing
language:en
Short-container-title:Materials Science in Semiconductor Processing

Author:

Lee Chang-Chun,Shen Yu-Lin,Kang Yuan

Funder

National Center for High-performance Computing (NCHC)

Ministry of Science and Technology of Taiwan, R.O.C

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference18 articles.

1. Delamination in patterned films

2. Mechanical properties and fracture toughness of multilayer hard coatings using nanoindentation

3. A modified blister test to study the adhesion of thin coatings based on local helium ion implantation

4. Interfacial fracture toughness measurement for thin film interfaces

5. A modified 4-point bend delamination test

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1. Development and verification of interfacial fracture energy simulation methodology for porous stacked thin films;Engineering Fracture Mechanics;2024-02

2. Interfacial and mechanical characteristics of TiN/Al composites under nanoindentation;International Journal of Solids and Structures;2021-09

3. Towards quantifying the shear delamination of thin films;Materialia;2019-12

4. Mixed mode interfacial crack energy estimation of glass interposer and SiNx coatings by using fracture mechanics based computer methods and experimental validations;Theoretical and Applied Fracture Mechanics;2018-08

5. The development of estimated methodology for interfacial adhesion of semiconductor coatings having an enormous mismatch extent;Applied Surface Science;2018-05

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