Mixed mode interfacial crack energy estimation of glass interposer and SiNx coatings by using fracture mechanics based computer methods and experimental validations-Reference-Cited by-同舟云学术

Mixed mode interfacial crack energy estimation of glass interposer and SiNx coatings by using fracture mechanics based computer methods and experimental validations

Published:2018-08 Issue: Volume:96 Page:790-794
ISSN:0167-8442
Container-title:Theoretical and Applied Fracture Mechanics
language:en
Short-container-title:Theoretical and Applied Fracture Mechanics

Author:

Lee Chang-Chun,Huang Pei-Chen

Funder

Ministry of Science and Technology (MOST), Taiwan, R.O.C.

Publisher

Elsevier BV

Subject

Applied Mathematics,Mechanical Engineering,Condensed Matter Physics,General Materials Science

Reference27 articles.

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3. Fabrication, assembly and testing of a glass interposer-based 3D systems in package;Amrani;Microelectron. Eng.,2016

4. Impact of copper through-package vias on thermal performance of glass interposers;Cho;IEEE Trans. Compon. Pack. Manuf. Technol.,2015

5. Finite element analysis and experiment validation of highly reliable silicon and glass interposers-to-printed wiring board SMT interconnections;Qin;IEEE Trans. Compon. Pack. Manuf. Technol.,2014

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