Study of small holes on monocrystalline silicon cut by WEDM

Author:

Huijun Pan,Zhidong Liu,Lian Gao,Mingbo Qiu,Zongjun Tian

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference11 articles.

1. Experimental investigation of wire electrical discharge machining of gallium-doped germanium

2. Line Curium Cut Monocrystalline Stress Field and Damaged Layer;Liu,2006

3. Grinding induced subsurface cracks in silicon wafers

4. J.M. Zhang, Z.J.Pei, J.G. Sun. Measurement of Subsurface Damage in Silicon Wafers, in: Proceedings of the 6th International Conference on Progress of Machining Technology, Xi'an, China, 2002, pp. 715–720.

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