Modeling and experiment of material removal rate for cutting single-crystal silicon by electrical discharge wire sawing
Author:
Funder
Key Research and Development Projects of Shaanxi Province
Shaanxi Provincial Department of Education Natural Science Youth Project
Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s00170-024-13796-1.pdf
Reference23 articles.
1. Zhao PY, Zhao B, Pan JS, Wu JW (2022) Nano-grinding process of single-crystal silicon using molecular dynamics simulation: Nano-grinding parameters effect. Mater Sci Semicond Process 143:106531. https://doi.org/10.1016/j.mssp.2022.106531
2. Zhao ZJ, Yin TF, To S, Zhu ZW, Zhuang ZX (2022) Material removal energy in ultraprecision machining of micro-lens arrays on single crystal silicon by slow tool servo. J Clean Prod 335:130295. https://doi.org/10.1016/j.jclepro.2021.130295
3. Pan HJ, Liu ZD, Gao L, Qiu MB, Tian ZJ (2013) Study of small holes on monocrystalline silicon cut by WEDM. Mater Sci Semicond Process 16:385–389. https://doi.org/10.1016/j.mssp.2012.09.006
4. Liu CL, Chen X, Ke JY, She ZD, Zhang JG, Xiao JF, Xu JF (2021) Numerical investigation on subsurface damage in nanometric cutting of single-crystal silicon at elevated temperatures. J Manuf Process 68:1060–1071. https://doi.org/10.1016/j.jmapro.2021.06.040
5. Choi DH, Lee JR, Kang NR, Je TJ, Kim JY, Jeon EC (2017) Study on ductile mode machining of single-crystal silicon by mechanical machining. Int J Mach Tools Manuf 113:1–9. https://doi.org/10.1016/j.ijmachtools.2016.10.006
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