Scallop-shaped p-type FinFETs with improved short-channel effects immunity and driving current

Author:

Zhang ZhaohaoORCID,Gan Weizhuo,Li Junjie,Kong Zhenzhen,Han Yanchu,Liu Yang,Wang Guilei,Wu ZhenhuaORCID,Yu Jiahan,Zhang Qingzhu,Xu Gaobo,Zhang Yongkui,Xiang Jinjuan,Yin Huaxiang,Luo Jun,Wang Wenwu

Funder

National Natural Science Foundation of China

Chinese Academy of Sciences

Youth Innovation Promotion Association

Foundation for Innovative Research Groups of the National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference15 articles.

1. A 22nm high performance and low-power CMOS technology featuring fully-depleted tri-gate transistors, self-aligned contacts and high density MIM capacitors;Auth,2012

2. A 14nm logic technology featuring 2nd -generation FinFET, air-gapped interconnects, self-aligned double patterning and a 0.0588 μm 2, SRAM cell size;Natarajan,2014

3. Tri-Gate bulk MOSFET design for CMOS scaling to the end of the roadmap;Sun;IEEE Electron. Device Lett.,2008

4. Improved short channel effect control in bulk FinFETs with vertical implantation to form self-aligned halo and punch-through stop pocket;Xu;IEEE Electron. Device Lett.,2015

5. Vertically stacked silicon nanowire transistors fabricated by inductive plasma etching and stress-limited oxidation;Ricky;IEEE Electron. Device Lett.,2009

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