1. ITRS site: http://public.itrs.net./Files/2003ITRS/Home2003.htm.
2. Future IC fabrication rests on solutions to circuit and device scaling issues;Zeitzoff;Solid State Technol,2002
3. High-k materials challenge deposition, etch, and metrology;Braun;Semicond. Int,2002
4. Metal gates only: high-k need not apply;Singer;Semicond. Int,2003
5. Example of an atomic layer deposition process: http://www.asm.com/proc_alcvd.asp.