Towards a maximal cell survival in convective thermal drying processes
Author:
Publisher
Elsevier BV
Subject
Food Science
Reference176 articles.
1. Microbial stress response in minimal processing;Abee;International Journal of Food Microbiology,1999
2. Mathematical model of thermal destruction of Bacillus stearothermophilus spores;Abraham;Applied and Environmental Microbiology,1990
3. A modified Weibull model for bacterial inactivation;Albert;International Journal of Food Microbiology,2005
4. Mechanisms of heat inactivation in Salmonella serotype Typhimurium as affected by low water activity at different temperatures;Aljarallah;Journal of Applied Microbiology,2007
5. Mathematical modeling of survival and weight loss of Baker's yeast during drying;Alpas;Enzyme and Microbial Technology,1996
Cited by 261 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Recent advances in the probiotic application of the Bacillus as a potential candidate in the sustainable development of aquaculture;Aquaculture;2025-01
2. Extrusion and Co-extrusion: A Technology in Probiotic Encapsulation with Alternative Materials;Current Pharmaceutical Biotechnology;2024-11
3. A formulation platform for incorporating live probiotics into different food matrices;Journal of Food Engineering;2024-10
4. The physicochemical properties of Cassava Starch/Carboxymethyl cellulose sodium edible film incorporated of Bacillus and its application in salmon fillet packaging;Food Chemistry: X;2024-10
5. Yacon Flour (Smallanthus sonchifolius) as Wall Material for Microencapsulation of Lacticaseibacillus rhamnosus GG: Characterization of Microparticles and Its Use in Pitaya Jelly;Food and Bioprocess Technology;2024-08-03
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3