Structure and stress of Cu films prepared by high power pulsed magnetron sputtering
Author:
Funder
NSFC
NSAF
Publisher
Elsevier BV
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation
Reference33 articles.
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3. Influence of substrate bias on the microstructure and internal stress in Cu films deposited by filtered cathodic vacuum arc;Cheng;J. Vac. Sci. Technol.: Vac. Surfaces Films,2001
4. Evolution of the morphology of Cu films on nanoporous Si pillar arrays;Hui Yang;Mater. Sci. Semicond. Process.,2013
5. A novel pulsed magnetron sputter technique utilizing very high target power densities;Kouznetsov;Surf. Coating. Technol.,1999
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