Influence of substrate bias on the microstructure and internal stress in Cu films deposited by filtered cathodic vacuum arc-Reference-Cited by-同舟云学术

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Influence of substrate bias on the microstructure and internal stress in Cu films deposited by filtered cathodic vacuum arc

Published:2001-09 Issue:5 Volume:19 Page:2102-2108
ISSN:0734-2101
Container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
language:en
Short-container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films

Author:

Cheng Y. H.,Tay B. K.,Lau S. P.,Shi X.,Tan H. S.

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

http://avs.scitation.org/doi/pdf/10.1116/1.1374619

Cited by 20 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of substrate bias on the formation of nanotwin and properties in Cu thin films for advanced packaging technology;Surface and Coatings Technology;2024-04

2. Measurement of Ion Energy Distribution and Deposition of Ti Thin Films Using ABPPS Technology on Glass Substrate;Coatings;2021-07-28

3. Structure and stress of Cu films prepared by high power pulsed magnetron sputtering;Vacuum;2019-02

4. Impact of Ge alloying on the early growth stages, microstructure and stress evolution of sputter-deposited Cu-Ge thin films;Acta Materialia;2018-10

5. Influence of sputtering power on structural, optical and electrical properties of CdTe thin films prepared by DC magnetron sputtering;Journal of Materials Science: Materials in Electronics;2018-07-05

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