Adhesive properties of deposited Cu films on colorless polyimide using high power impulse magnetron sputtering system-Reference-Cited by-同舟云学术

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Adhesive properties of deposited Cu films on colorless polyimide using high power impulse magnetron sputtering system

Published:2024-05 Issue: Volume:484 Page:130710
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Tsai Yuan-Nan,Chen Hsin-Yo,Tseng I-Hsiang,Lee Jyh-Wei,Tsai Mei-Hui,Li Ming-Syuan,Wang Chih-Hsing,Gee Chuen-Ming,Chen Tzu-Ling,Tsai Pin-Chen

Publisher

Elsevier BV

Reference35 articles.

1. Flexible electronics: the next ubiquitous platform;Nathan;Proc. IEEE,2012

2. 25th anniversary article: the evolution of electronic skin (e-skin): a brief history, design considerations, and recent progress;Hammock;Adv. Mater.,2013

3. A review on colorless and optically transparent polyimide films: chemistry, process and engineering applications;Ni;J. Ind. Eng. Chem.,2015

4. Handbook of Physical Vapor Deposition (PVD) Processing;Mattox,2010

5. High power impulse magnetron sputtering discharge;Gudmundsson;J. Vac. Sci. Technol. A,2012

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