Comparative study of Cl2 + O2 and HBr + O2 plasma chemistries in respect to silicon reactive-ion etching process
Author:
Funder
Ministry of Trade, Industry and Energy
Publisher
Elsevier BV
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation
Reference63 articles.
1. Dry Etching for VLSI;Roosmalen,1991
2. Applications of Plasma Processes to VLSI Technology;Sugano,1990
3. Industrial Plasma Engineering;Rooth,1995
4. Handbook of Plasma Processing Technology;Rossnagel,1990
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Plasma Parameters and Kinetics of Reactive Ion Etching of SiO2 and Si3N4 in an HBr/Cl2/Ar Mixture;Russian Microelectronics;2023-04
2. Plasma Parameters and Kinetics of Reactive Ion Etching of SiO2 and Si3N4 in an HBr/Cl2/Ar Mixture;Микроэлектроника;2023-03-01
3. Gas-phase parameters and densities of atomic species in Cl2 + O2 + Ar plasma: Effects of O2/Ar and Cl2/Ar mixing ratios;Vacuum;2023-01
4. On the Effect of the Cl2 + O2 + Ar Mixture Composition on the Concentrations of Chlorine and Oxygen Atoms in a Plasma;Russian Microelectronics;2022-12
5. Mechanism and solution of sharp defects in trench double-diffused metal-oxide semiconductor polysilicon recess etching;Journal of Vacuum Science & Technology B;2021-12
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3