Sn and Bi whisker growth from SAC0307-Mn07 and SAC0307-Bi1-Mn07 ultra-thin film layers-Reference-Cited by-同舟云学术

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Sn and Bi whisker growth from SAC0307-Mn07 and SAC0307-Bi1-Mn07 ultra-thin film layers

Published:2021-05 Issue: Volume:187 Page:110121
ISSN:0042-207X
Container-title:Vacuum
language:en
Short-container-title:Vacuum

Author:

Illés Balázs,Hurtony Tamás,Medgyes Bálint,Krammer Olivér,Dusek Karel,Busek David

Funder

Nemzeti Kutatási Fejlesztési és Innovációs Hivatal

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation

Reference40 articles.

1. Whisker growth in Sn and SnPb thin films under electromigration;Zhou;Vacuum,2014

2. Effect of Cu substrate roughness and Sn layer thickness on whisker development from Sn thin-films;Illés;Materials,2019

3. Electric field stimulated growth of Zn whiskers;Niraula;AIP Adv.,2016

4. Mechanism and mitigation of spontaneous Ga whisker growth on Cr2GaC;Zhang;Sci. China Technol. Sci.,2020

5. Isotope study reveals atomic motion mechanism for the formation of metal whiskers in MAX phase;Lu;Acta Mater.,2021

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1. The role of stress release in shaping iron whisker morphology during oxygen removal process;Scripta Materialia;2024-01

2. Dynamic growth mechanism of tin whisker driven by compressive stress under thermal-mechanic-electric-diffusion coupling;Vacuum;2023-09

3. Influence of 1,8-naphthalimide derivatives as additives on the electrodeposition of tin from methanesulfonic acid system;Dyes and Pigments;2022-11

4. Suppression of Sn whisker growth from SnAgCu solder alloy with TiO2 and ZnO reinforcement nano-particles by increasing the corrosion resistance of the composite alloy;Journal of Materials Research and Technology;2022-09

5. The Effect of Bi and Zn Additives on Sn-Ag-Cu Lead-Free Solder Alloys for Ag Reduction;Metals;2022-07-25

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