Dynamic growth mechanism of tin whisker driven by compressive stress under thermal-mechanic-electric-diffusion coupling
Author:
Publisher
Elsevier BV
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation
Reference38 articles.
1. Interface flow mechanism for tin whisker growth;Howard;Acta Mater.,2011
2. Whisker growth in Sn coatings: a review of current status and future prospects;Jagtap;J. Electron. Mater.,2021
3. Spontaneous growth of metal whiskers on surfaces of solids: a review;Zhang;J. Mater. Sci. Technol.,2015
4. Growth behavior of tin whisker on SnAg microbump under compressive stress;Sun;Scripta Mater.,2018
5. A unified Kinetic Model for stress relaxation and recovery during and after growth interruptions in polycrystalline thin films;Chason;Acta Mater.,2020
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