Whisker growth in Sn and SnPb thin films under electromigration
Author:
Publisher
Elsevier BV
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation
Reference20 articles.
1. The growth of Sn whiskers with dislocation inclusion upon electromigration through a Cu/Sn3.5Ag/Au solder joint
2. The suppression of tin whisker growth by the coating of tin oxide nano particles and surface treatment
3. Sn-whiskers: truths and myths
4. The origin of driving force for the formation of Sn whiskers at room temperature
5. Spontaneous whisker growth on lead-free solder finishes
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1. Method for inhibiting Sn whisker growth on Ti2SnC;Journal of Materials Science;2022-10-31
2. Effect of Electromigration and Thermal Ageing on the Tin Whiskers’ Formation in Thin Sn–0.7Cu–0.05Ga Lead (Pb)-Free Solder Joints;Coatings;2021-08-04
3. Sn and Bi whisker growth from SAC0307-Mn07 and SAC0307-Bi1-Mn07 ultra-thin film layers;Vacuum;2021-05
4. Observation of void formation patterns in SnAg films undergoing electromigration and simulation using random walk methods;Scientific Reports;2021-04-21
5. The effect of Bi addition on the formation of metal whiskers in Ti2SnC/Sn-xBi system;Vacuum;2020-12
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