Author:
Chan Y.C.,Fan S.H.,Hung K.C.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference9 articles.
1. Chip on Board;Suryanarayana,1994
2. C.P. Wong D.F. Baldwin No-flow underfill for flip-chip packages, U.S. Patent Disclosure (in progress), April 1996.
3. S.H. Shi, C.P. Wong, Study of the fluxing agent effects on the properties of no-flow underfill materials for flip-chip applications, Proceedings of the 48th ECTC, Seattle, Washington, 26–28 May, (1998) 117–124.
4. C.P. Wong, D. Baldwin, M.B. Vincent, B. Fennell, L.J. Wang, S.H. Shi, Characterization of a no-flow underfill encapsulant during the solder reflow process, Proceedings of the 48th ECTC, Seattle, Washington, 26–28 May, (1998) 1253–1259.
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