Effect of Halogenation Treatment by Hydrofluoric Acid on Bond Strength of Pressure Welded Interface of Tin
Author:
Affiliation:
1. Department of Mechanical Engineering, Gunma University
Publisher
Japan Society of Mechanical Engineers
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
https://www.jstage.jst.go.jp/article/kikaia1979/76/769/76_KJ00006628220/_pdf
Reference10 articles.
1. 1) KOYAMA S. BEHAVIOR OF SUPERFICIAL OXIDE FILM IN SOLID-STATE DIFFUSION-BONDING OF TIN AND ITS INFLUENCE ON BOND STRENGTH. Acta Metallurgica Slovaca. (2004) vol.10, p.75-82.
2. 2) CHAN Y. C. The effect of metal oxide on the no-flow underfill fluxing capacity. Materials Science and Engineering, B. (2001) vol.85, p.64-69.
3. 3) KIM D. Fluxless flip-chip Sn-Au solder interconnect on thin Si wafers and Cu laminated polyimide film. Materials Science and Engineering, A. (2006) vol.416, p.74-79.
4. 4) CHUNG C. Influence of Flux on Wetting Behavior of Lead-Free Solder Balls during the Infrared-Reflow Process. Journal of ELECTRONIC MATERIALS. (2005) vol.34, no.7, p.994-1001.
5. 5) NARAYAN PRABHU K. Effect of substrate surface texture and flux coating on the evolution of microstructure during solidification of lead free Sn-3.5Ag solder alloy. Materials and Design. (2004) vol.25, p.447-449.
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