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Theoretical study of adhesion energy measurement for film/substrate interface using pressurized blister test: Energy release rate

  • Published:2013-10 Issue:8 Volume:46 Page:2278-2287
  • ISSN:0263-2241
  • Container-title:Measurement
  • language:en
  • Short-container-title:Measurement

Author:

Sun Jun-yi,Qian Shao-hua,Li Ying-min,He Xiao-ting,Zheng Zhou-lian

Funder

National Natural Science Foundation of China

Fundamental Research Funds for the Central Universities, PR China

Publisher

Elsevier BV

Subject

Applied Mathematics,Electrical and Electronic Engineering,Condensed Matter Physics,Instrumentation

Reference21 articles.

1. Determination of dielectric constant and loss of high-K thin films in the microwave frequencies;Sudheendran;Measurement,2010

2. Study of quantitative influence of sample defects on measurements of resistivity of thin films using van der Pauw method;Náhlík;Measurement,2011

3. Measurement of adhesion by a blister method;Dannenberg;Journal of Applied Polymer Science,1961

4. The strength of adhesive joints using the theory of cracks;Malyshev;International Journal of Fracture,1965

5. The continuum interpretation for fracture and adhesion;Williams;Journal of Applied Polymer Science,1969
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