Cleaning of diffusion bonding surface by argon ion bombardment treatment
Author:
Publisher
Elsevier BV
Subject
Instrumentation,Nuclear and High Energy Physics
Reference15 articles.
1. Effect of Initial Microstructure of Intermediate Material on Superplastic Diffusion Bonding of Duplex Stainless Steel.
2. Effect of Argon Ion Bombardment on Strength of Diffusion Bonded Joints of Cu and Ti
3. Effect of Argon Ion Bombardment on the Solid-State Diffusion Bonding of Copper
4. Effect of surface condition and bonding pressure on quality of diffusion bonded high purity copper for linear collider accelerator structures
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1. Diffusion bonding of pre-friction treated structural steel with reversion of deformation induced grains;Materials Science and Engineering: A;2017-06
2. Identification of the Chemical Bonding Prompting Adhesion of a-C:H Thin Films on Ferrous Alloy Intermediated by a SiCx:H Buffer Layer;ACS Applied Materials & Interfaces;2015-07-20
3. Computer study of the removal of Cu from the graphene surface using Ar clusters;Computational Materials Science;2015-02
4. Bonding Mechanisms in Resistance Microwelding of 316 Low-Carbon Vacuum Melted Stainless Steel Wires;Metallurgical and Materials Transactions A;2009-02-20
5. Interface microstructure of aluminum die-casting alloy joints bonded by pulse electric-current bonding process;Materials Science and Engineering: A;2006-07
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