Effect of Argon Ion Bombardment on the Solid-State Diffusion Bonding of Copper-Reference-Cited by-同舟云学术

Effect of Argon Ion Bombardment on the Solid-State Diffusion Bonding of Copper

Published:1998-04 Issue:10 Volume:38 Page:1525-1532
ISSN:1359-6462
Container-title:Scripta Materialia
language:en
Short-container-title:Scripta Materialia

Author:

Khan T.I,Ohashi O

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering

Reference13 articles.

1. Modelling solid-state diffusion bonding

2. S. A. Davies, N. J. Barrett, M. R. Castell, P. Allen, and R. Clampitt, in the 2nd European Vacuum Conference, Trieste, Italy, 21–26 May, 463 (1990).

3. O. Ohashi and T. I. Khan, in Conference Proceedings on Materials Interconnection, Japan Institute for Metals, 113, 71 (1993).

4. Effect of Surface Composition on Diffusion Welding in Stainless Steel

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