The mechanism of field-assisted silicon-glass Bonding-Reference-Cited by-同舟云学术

The mechanism of field-assisted silicon-glass Bonding

Published:1990-04 Issue:1-3 Volume:23 Page:939-943
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Kanda Yozo,Matsuda Kazunori,Murayama Chizuko,Sugaya Junko

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference18 articles.

1. Field assisted glass-metal sealing;Wallis;J. Appl. Phys.,1969

2. A batch-fabricated silicon accelerometer;Roylance;IEEE Trans. Electron Devices,1979

3. A gas chromatographic air analyzer fabricated on silicon wafer;Terry;IEEE Trans. Electron Devices,1979

4. Fabrication of an integrated, planar silicon ink-jet structure;Petersen;IEEE Trans. Electron Devices,1979

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