1. Microsensor packaging and system partitioning;Senturia;Sensors and Actuators,1988
2. On-chip decoupling zone for package-stress reduction;Spiering;Proc. 6th Int. Conf. Solid-State Sensors and Actuators (Transducers '91), San Francisco, CA, USA,1991
3. Novel stress free assembly technique for micromechanical devices;Offereins;Proc. Micro System Technologies 90,. Berlin, Germany,1990
4. The effect of corner radius of curvature on the mechanical strength of micromachined single-crystal silicon structures;Pourahmadi;Proc. 6th Int. Conf. Solid-State Sensors and Actuators (Transducers '91), San Francisco, CA, USA,1991
5. Chemical etching of silicon: IV. Etching technology;Schwartz;J. Electrochem. Soc.,1976