1. Finite-element modelling and characterization of a silicon condenser microphone with a highly perforated backplate
2. A silicon condenser microphone using bond and etch-back technology
3. Bergqvist J, Rudolf F: Process for the manufacture of integrated capacitive transducers. United States Patent 5,404,731, 1995.
4. Cui W, Bicen B, Hall N, Jones SA, Degertekin FA, Miles RN: Optical sensing in a directional MEMS microphone inspired by the ears of the parasitoid fly, Ormia ochracea. Proc IEEE Int Conf Micro Electro Mech Sys, Istanbul, January 2006.