A neural network model for the wire bonding process

Author:

Wang Qiwen,Sun Xiaoyun,Golden Bruce L.,Desilets Lenore,wasil Edward A.,Luco Scott,Peck Adam

Publisher

Elsevier BV

Subject

Management Science and Operations Research,Modeling and Simulation,General Computer Science

Reference4 articles.

1. Controlling industrial processes through supervised, feedforward neural networks;Smith;Comps Indust. Engng,1991

2. Learning internal representations by error propagation;Rumelhart,1986

3. Jackknife method for validating neural network models;Allred,1991

4. Validating a neural network model for predicting wire bond quality;Wang,1992

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4. Monitoring wire bonding via time-frequency analysis of horn vibration;IEEE Transactions on Electronics Packaging Manufacturing;2003-07

5. Dynamic characteristics of stacked piezoelectric transducers of ultrasonic wire bonders used in integrated circuit packaging;Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science;2003-03-01

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