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Deformation analysis of Au wire bonding

  • Published:2006-07 Issue:1-3 Volume:177 Page:709-712
  • ISSN:0924-0136
  • Container-title:Journal of Materials Processing Technology
  • language:en
  • Short-container-title:Journal of Materials Processing Technology

Author:

Saiki Hiroyuki,Marumo Yasuo,Nishitake Hiroshi,Uemura Tetsuhiro,Yotsumoto Takahiro

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites

Reference12 articles.

1. Effects of wire quality and capillary maintenance on bonding reliability;Cohn;Microelectron. Reliab.,1976

2. An experimental model of the microelectronic ultrasonic wire bonding mechanism;Harman;Microelectron. Reliab.,1973

3. Alloyed thick-film gold conductor for high reliability high-yield wire bonding;Horowitz;Microelectron. Reliab.,1980

4. Formation of clean Al surface by interface deformation in Au–Al thermo-compression bonding;Ishizaka;J. Jpn. Instrum. Met.,1977

5. Fundamental study for microjoining in LSI;Nakane;J. High Temp. Soc.,1987

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