Joint reliability of Al wire bonding on OSP and ENIG surface-finished substrates under complex stress induced with current and temperature
Author:
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Link
https://link.springer.com/content/pdf/10.1007/s10854-022-08917-z.pdf
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