Deformation characteristics of Au wire bonding-Reference-Cited by-同舟云学术

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Deformation characteristics of Au wire bonding

Published:2007-08 Issue:1-3 Volume:191 Page:16-19
ISSN:0924-0136
Container-title:Journal of Materials Processing Technology
language:en
Short-container-title:Journal of Materials Processing Technology

Author:

Saiki Hiroyuki,Nishitake Hiroshi,Yotsumoto Takahiro,Marumo Yasuo

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modelling and Simulation,Ceramics and Composites

Reference13 articles.

1. An experimental model of the microelectronic ultrasonic wire bonding mechanism;Harman;Microelectron. Reliab.,1973

2. Alloyed thick-film gold conductor for high reliability high-yield wire bonding;Horowitz;Microelectron. Reliab.,1980

3. Wirebonding at higher ultrasonic frequencies: reliability and process implications;Charles;Microelectron. Reliab.,2003

4. Formation of clean Al surface by interface deformation in Au–Al thermo-compression;Ishizaka;J. Jpn. Inst. Met.,1997

5. Fundamental Study for Microjoining in LSI;Nakane;J. High Temp. Soc.,1987

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