Author:
Tan C.W.,Chiu Y.W.,Chan Y.C.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference14 articles.
1. Conductive Adhesive For Electronics Packaging;Liu,1999
2. Electro-thermo-mechanical responses of conductive adhesive materials
3. Reliability of 80 μm pitch flip chip attachment on flex
4. R.D. Burg, J.H. Constable, J.J. Decker, J.W. Weidler, Electrical characteristics of an ACF bond as a function of temperature and humidity aging. Proceedings of IEEE Electronic Component and Technology Conference, 2000, pp. 906–913.
5. On the failure mechanism of anisotropically conductive adhesive joints on copper metallisation
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