Author:
Palm Petteri,Määttänen Jarmo,Tuominen Aulis,Ristolainen Eero
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference9 articles.
1. Nagai A, Takemura K, Watanabe I. Reliability of flip chip interconnection using anisotropically conductive adhesive films onto organic substrates. The Third 1999 IEMT/IMC Symp, Tokyo, Japan, 21–23 April 1999
2. Kallmayer C, Oppermann H, Anhöck S, Azadeh R, Acshenbrenner R, Reichl H. Reliability investigations for flip chip on flex using different solder materials. IEEE Electronic Compon Technol Conf 1998. p. 303–309
3. Määttänen J, Palm P, Tuominen A, Ristolainen E. Development of high density flip chip on flex process using anisotropically condustive adhesives. 2000 IEMT/IMC Symp Omiya, Japan, 19–21 April 2000
4. Aschenbrenner R, Mießner R, Reichl H. Adhesive flip chip bonding on flexible substrates. IEEE Internat Sympos Polymer Electr Packag. PEP 26–30 October 1997. p. 86–94
5. Holloway M, Crane L, Peters S. A roadmap to flip chip assembly using advanced adhesives. IMAPS-Nordic, Helsinki, Finland, 19–22 September 1999. p. 89–96
Cited by
19 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献