Considering agitation in ultrasonic electroplating through observation of cavitation-Reference-Cited by-同舟云学术

Considering agitation in ultrasonic electroplating through observation of cavitation

Published:2023-06 Issue: Volume:96 Page:106432
ISSN:1350-4177
Container-title:Ultrasonics Sonochemistry
language:en
Short-container-title:Ultrasonics Sonochemistry

Author:

Nozawa Taisuke^ORCID

Publisher

Elsevier BV

Subject

Acoustics and Ultrasonics,Radiology, Nuclear Medicine and imaging,Chemical Engineering (miscellaneous),Inorganic Chemistry,Organic Chemistry,Environmental Chemistry

Reference25 articles.

1. The Applications of Ultrasound in Electroplating

2. Effect of ultrasound on mass transfer during electrodeposition for electrodes separated by a narrow gap

3. High-speed and high-quality TSV filling with the direct ultrasonic agitation for copper electrodeposition

4. The effect of ultrasonic frequency and intensity upon limiting currents at rotating disc and stationary electrodes

5. The effect upon limiting currents and potentials of coupling a rotating disc and cylindrical electrode with ultrasound

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