Mechanical and structural properties of electrodeposited copper and their relation with the electrodeposition parameters
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry
Reference24 articles.
1. Modern Electroplating;Schlesinger,2000
2. Formation of amorphous electrodeposited Ni-W alloys and their nanocrystallization
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4. Electrodeposition of adherent copper film on unmodified tungsten
5. DC/pulse plating of copper for trench/via filling
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