DC/pulse plating of copper for trench/via filling
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modelling and Simulation,Ceramics and Composites
Reference12 articles.
1. S. Venkatesan, et al., in: Proceedings of the IEDM Conference, 1997, p. 769.
2. D. Edelstein, et al., Proceedings of the IEDM Conference, 1997, p. 773.
3. J. Heidenreich, et al., IITC 1 (1998) 151.
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