Adhesion properties of Cu/Cr films on polyimide substrate treated by dielectric barrier discharge plasma-Reference-Cited by-同舟云学术

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Adhesion properties of Cu/Cr films on polyimide substrate treated by dielectric barrier discharge plasma

Published:2005-04 Issue:1-3 Volume:193 Page:101-106
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Kim Soo Hong,Cho Su Hyeun,Lee N.-E.,Kim Hoon Mo,Nam Yun Woo,Kim Young-Ho

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference16 articles.

1. Polyimides—Fundamentals and Applications;Strunskus,1994

2. Polymers for Electronic Applications;Lai,1989

3. Plastic Packaging of Microelectronic Devices;Manzione,1990

4. Plasma Surface Modification of Polymers: Relevance to Adhesion,1994

5. Plasma Surface Modification of Polymers: Relevance to Adhesion;Liston,1994

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