Effect of Ar and N<sub>2</sub> plasma etching on adhesion between mold resin and sputtered Cu in semiconductor electromagnetic shielding-Reference-Cited by-同舟云学术

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Effect of Ar and N₂ plasma etching on adhesion between mold resin and sputtered Cu in semiconductor electromagnetic shielding

Published:2023-08-08 Issue: Volume: Page:1-24
ISSN:0169-4243
Container-title:Journal of Adhesion Science and Technology
language:en
Short-container-title:Journal of Adhesion Science and Technology

Author:

Homma Soichi¹²,Shima Masaya¹,Takano Yuusuke¹,Watanabe Takeshi³,Fukuda Masatoshi¹,Imoto Takashi⁴,Nishikawa Hiroshi⁵

Affiliation:

1. Memory Packaging Development Department, Kioxia Corporation, Yokkaichi, Mie, Japan

2. Graduate School of Engineering, Osaka University, Suita, Osaka, Japan

3. Memory Packaging Engineering Department, Kioxia Corporation, Yokkaichi, Mie, Japan

4. Memory Packaging Development Department, Kioxia Corporation, Yokohama, Kanagawa, Japan

5. Joining and Welding Research Institute, Osaka University, Ibaraki, Osaka, Japan

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

https://www.tandfonline.com/doi/pdf/10.1080/01694243.2023.2243679

Reference48 articles.

1. Measurement of IC package shielding effectiveness using an integrated antenna

2. Millimeter-wave band slot antenna on shielded BGA package

3. SOP Integration and Codesign of Antennas

4. Study on a Conformal Shielding Structure With Conductive Adhesive Coated on Molding Compound in 3-D Packages

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