Exploring three-point-bending fracture toughness of thick diamond films from different directions-Reference-Cited by-同舟云学术

Exploring three-point-bending fracture toughness of thick diamond films from different directions

Published:2022-10 Issue: Volume:448 Page:128888
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

An Kang,Liu Peng,Shao Siwu,Li Haixia,Yang Zhiliang,Zhang Shuai,Li Shiyu,Huang Yabo,Liu Jinlong,Chen Liangxian,Wei Junjun,Zheng Yuting,Liu Qing,Liu Fengbin,Li Chengming

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference31 articles.

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2. A new method to evaluate the fracture toughness of thin films;Xia;Acta Mater.,2004

3. Toughness measurement of thin films: a critical review;Zhang;Surf. Coat. Technol.,2005

4. Ultralarge elastic deformation of nanoscale diamond;Banerjee;Science,2018

5. Achieving large uniform tensile elasticity in microfabricated diamond;Dang;Science,2021

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