Ultralarge elastic deformation of nanoscale diamond

Author:

Banerjee Amit12ORCID,Bernoulli Daniel3ORCID,Zhang Hongti14ORCID,Yuen Muk-Fung25ORCID,Liu Jiabin1ORCID,Dong Jichen6,Ding Feng67,Lu Jian14ORCID,Dao Ming3ORCID,Zhang Wenjun25ORCID,Lu Yang124ORCID,Suresh Subra8ORCID

Affiliation:

1. Department of Mechanical and Biomedical Engineering, City University of Hong Kong, Kowloon, Hong Kong, China.

2. Centre of Super-Diamond and Advanced Films (COSDAF), City University of Hong Kong, Kowloon, Hong Kong, China.

3. Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.

4. Centre for Advanced Structural Materials, Shenzhen Research Institute of City University of Hong Kong, Shenzhen 518057, China.

5. Department of Materials Science and Engineering, City University of Hong Kong, Kowloon, Hong Kong, China.

6. Center for Multidimensional Carbon Materials, Institute for Basic Science (IBS), Ulsan 44919, Republic of Korea.

7. Department of Materials Science and Engineering, Ulsan National Institute of Science and Technology (UNIST), Ulsan 44919, Republic of Korea.

8. Nanyang Technological University, Singapore 639798, Republic of Singapore.

Abstract

Small, smooth, and bendable diamonds If you manage to deform a diamond, it usually means you have broken it. Diamonds have very high hardness, but they do not deform elastically. This limits their usefulness for some applications. However, Banerjee et al. discovered that diamond nanoneedles can deform elastically after all (see the Perspective by LLorca). The key was in their small size (300 nm), which allowed for very smooth-surfaced, defect-free diamonds. The deformation was close to the theoretical limit for diamond, which opens up the potential for applications in microelectronics and drug delivery. Science , this issue p. 300 ; see also p. 264

Funder

Singapore-MIT Alliance for Research and Technology Centre

Nanyang Technological University

Swiss National Science Foundation

National Natural Science Foundation of China

Research Grants Council, University Grants Committee, Hong Kong

Institute for Basic Science of South Korea

Shenzhen Science Technology and Innovation Commission

Publisher

American Association for the Advancement of Science (AAAS)

Subject

Multidisciplinary

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