Interfacial microstructures and mechanical properties of molten Sn reacting with Ni– x P films-Reference-Cited by-同舟云学术

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Interfacial microstructures and mechanical properties of molten Sn reacting with Ni– x P films

Published:2016-10 Issue: Volume:303 Page:112-118
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Hsieh W.Z.,Rahman M.A.,Yang T.H.,Kuo T.T.,Ho C.E.

Funder

Ministry of Science and Technology (R.O.C.)

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference30 articles.

1. Interfacial reactions and shear strengths between Sn–Ag-based Pb-free solder balls and Au/EN/Cu metallization;Kim;J. Electron. Mater.,2004

2. Interfacial reactions between Sn–0.4Cu solder and Cu substrate with or without ENIG plating layer during reflow reaction;Yoon;J. Alloys Compd.,2005

3. Pronounced effects of Ni(P) thickness on the interfacial reaction and high impact resistance of the solder/Au/Pd(P)/Ni(P)/Cu reactive system;Ho;Surf. Coat. Technol.,2014

4. Comparative study between Sn37Pb and Sn3Ag0.5Cu soldering with Au/Pd/Ni(P) tri-layer structure;Peng;J. Alloys Compd.,2010

5. Impurity and alloying effects on interfacial reaction layers in Pb-free soldering;Laurila;Mater. Sci. Eng.,2010

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of Ni(P) thickness of ultrathin ENEPIG on the interfacial reaction and board level reliability of solder joints;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06

2. Effect of Morphological Change of Ni3Sn4 Intermetallic Compounds on the Growth Kinetics in Electroless Ni-P/Sn-3.5Ag Solder Joint;Metallurgical and Materials Transactions A;2020-03-31

3. Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability;Journal of Electronic Materials;2020-02-19

4. Interfacial reaction and mechanical reliability between Sn-3Ag-0.5Cu alloy and ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu metallization pad;Surface and Coatings Technology;2019-02

5. Interfacial microstructure and mechanical reliability of the Sn-Ag-Cu/Au/Pd(xP)/Ni(P) reactive system: P content effects;Surface and Coatings Technology;2018-09

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