Anisotropy and texture in thin copper films—an elasto-plastic analysis
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference22 articles.
1. Stress evolution in passivated thin films of Cu on silica substrates;Shen;J Mater Res,1998
2. Stress–temperature behaviour of unpassivated thin copper films;Keller;Acta Mater,1999
3. Yield stress in single crystal and polycrystalline Al films;Traub;Mater Res Soc Proc,1995
4. Stress and plasticity in Cu thin films;Weihnacht;AIP Conf Proc,1999
5. Micro-tensile and fatigue testing of copper thin films on substrates;Hommel;Mater Res Soc Proc,1999
Cited by 19 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Intragranular thermal fatigue of Cu thin films: Near-grain boundary hardening, strain localization and voiding;Acta Materialia;2023-07
2. Role of Grain Boundary Sliding in Structural Integrity of Cu-Filled Through Si Via During Isothermal Annealing;Journal of Electronic Materials;2020-09-28
3. Study of the Influence of Elastic Anisotropy of Cu on Thermo-Mechanical Behavior and Cu Protrusion of Through Silicon Vias Using Combined Phase Field and Finite Element Methods;IEEE Transactions on Device and Materials Reliability;2019-06
4. Film thickness dependent microstructural changes of thick copper metallizations upon thermal fatigue;Journal of Materials Research;2017-06-13
5. Orientation dependence of nitrogen supersaturation in austenitic stainless steel during low-temperature gas-phase nitriding;Acta Materialia;2014-10
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3