Stress induced diffusion along adhesional contact interfaces
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference27 articles.
1. Takahashi Y, Matsuka S. J. Adhesion Sci and Technol 2003;17(3):435.
2. Recent void shrinkage models and their applicability to diffusion bonding
3. A numerical analysis of void shrinkage processes controlled by coupled surface and interface diffusion
4. A second report on sintering diagrams
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