Enhancement of thermal conductivity and insulation of silicone thermal interface material through surface modification and synergistic effects of nanofillers for thermal management of electronic devices-Reference-Cited by-同舟云学术

Enhancement of thermal conductivity and insulation of silicone thermal interface material through surface modification and synergistic effects of nanofillers for thermal management of electronic devices

Published:2024-05 Issue: Volume:145 Page:111064
ISSN:0925-9635
Container-title:Diamond and Related Materials
language:en
Short-container-title:Diamond and Related Materials

Author:

Shi Song,Zhang Da,Bi Lansen,Ding Ruixin,Ren Wenshuo,Tang Xinqiao,He Yan

Funder

Taishan Scholar Foundation of Shandong Province

Taishan Scholar Project of Shandong Province

National Natural Science Foundation of China

Publisher

Elsevier BV

Reference64 articles.

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4. Present and future thermal interface materials for electronic devices;Razeeb;Int. Mater. Rev.,2017

5. Strategies for enhancing thermal conductivity of polymer-based thermal interface materials: a review;Ma;J. Mater. Sci.,2020

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