Microstructure and thermo-mechanical properties of pressureless infiltrated SiCp/Cu composites
Author:
Publisher
Elsevier BV
Subject
General Engineering,Ceramics and Composites
Reference23 articles.
1. The microstructure and the thermal expansion characteristics of Cu/SiCp composites;Shu;Mater Sci Eng A,2003
2. Role of compound formation in reactive wetting: The Cu/SiC system;Rado;Acta Mater,2000
3. Silicon carbide whisker copper matrix composites fabricated by hot pressing copper coated whiskers;Yih;J Mater Sci,1996
4. Fabrication of CuSiC metal matrix composites;Sundberg;J Mater Sci,2006
5. Schubert T, Brendel A, Schmid K, Koeck T, Ciupinski L. Interfacial design of Cu/SiC composites prepared by powder metallurgy for heat sink applications: Composites Part A 2007;38:2398–2403.
Cited by 29 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Fabrication of a novel high electrical conductivity Si3N4 matrix composite with Cu three-dimensional network structure by spark plasma sintering;Journal of Alloys and Compounds;2024-10
2. Hybrid effect on mechanical and thermal performance of copper matrix composites reinforced with SiC whiskers;Ceramics International;2024-05
3. Advancements in SiC-Reinforced Metal Matrix Composites for High-Performance Electronic Packaging: A Review of Thermo-Mechanical Properties and Future Trends;Micromachines;2023-07-25
4. Interfacial Stabilities, Electronic Properties and Interfacial Fracture Mechanism of 6H-SiC Reinforced Copper Matrix Studied by the First Principles Method;Crystals;2021-12-30
5. Studies on wear behaviour of silicon carbide and fly ash reinforced copper based metal matrix composites;Materials Today: Proceedings;2021
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3