The microstructure and the thermal expansion characteristics of Cu/SiCp composites
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference29 articles.
1. Microstructural characterization and tensile properties of hot pressed Al–SiC composites prepared from pure Al and Cu powders
2. Effects of thermal processing on thermal expansion coefficient of a 50 vol.% SiCp/Al composite
3. 6061Al/Al–SiCp bi-layer composites produced by plasma-spraying process
4. Co-sintering of tungsten alloy slurry coated alumina composites and their properties
5. Thermal expansion of metal–ceramic composites: a three-dimensional analysis
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