Enhanced conductivity induced by attractive capillary force in ternary conductive adhesive

Author:

Sun HongyeORCID,Zhang Xinfeng,Yuen Matthew M.F.

Funder

Research Grants Council of Hong Kong

Publisher

Elsevier BV

Subject

General Engineering,Ceramics and Composites

Reference44 articles.

1. Ternary Ag/epoxy adhesive with excellent overall performance;Ji;ACS Appl. Mater. Interfaces,2015

2. Bioinspired modification of h-BN for high thermal conductive composite films with aligned structure;Shen;ACS Appl. Mater. Interfaces,2015

3. High-performance thermal interface technology overview;Linderman,2007

4. Conductivity enhancement in carbon nanocone adhesive by electric field induced formation of aligned assemblies;Knaapila;ACS Appl. Mater. Interfaces,2011

5. Percolation theory applied to the analysis of thermal interface materials in flip-chip technology;Devpura,2000

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