Spectroscopic investigation of oxidized solder surfaces-Reference-Cited by-同舟云学术

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Spectroscopic investigation of oxidized solder surfaces

Published:2011-06 Issue:6 Volume:53 Page:2283-2288
ISSN:0010-938X
Container-title:Corrosion Science
language:en
Short-container-title:Corrosion Science

Author:

Song Jenn-Ming,Chang-Chien Yu-Chien,Huang Bo-Chang,Chen Wei-Ting,Shie Chi-Rung,Hsu Chuang-Yao

Publisher

Elsevier BV

Subject

General Materials Science,General Chemical Engineering,General Chemistry

Reference18 articles.

1. Lead-free Solders in Microelectronics

2. Reflow ageing influences and wettability effects of immersion tin final finishes with lead‐free solder

3. Cavasin, in: Electronic Components and Technology Conference 2006, art. No. 1645784, 1060-1063.

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1. Electronic component solderability assessment algorithm by deep external visual inspection;2020 IEEE Physical Assurance and Inspection of Electronics (PAINE);2020-12-15

2. Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing;Corrosion Science;2018-07

3. A phenomenological study of a Sn–Ag–Al composite solder reinforced with Mg–MWCNT: Improved electrical conductivity and thermo-physical performance;Materials & Design;2018-02

4. Colorimetric visualization of tin corrosion: A method for early stage corrosion detection on printed circuit boards;Microelectronics Reliability;2017-06

5. Study of electroless Sn-coated Cu microparticles and their application as a high temperature thermal interface material;Surface and Coatings Technology;2017-06

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