Colorimetric visualization of tin corrosion: A method for early stage corrosion detection on printed circuit boards-Reference-Cited by-同舟云学术

Colorimetric visualization of tin corrosion: A method for early stage corrosion detection on printed circuit boards

Published:2017-06 Issue: Volume:73 Page:158-166
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Verdingovas Vadimas^ORCID,Jellesen Morten Stendahl,Ambat Rajan

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference27 articles.

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4. Corrosion, Flux, IPC-TM-650 Test method 2.6.15, IPC,2004

5. Flux Induced Corrosion (Copper Mirror Method), IPC-TM-650 Test method 2.3.32, IPC,2004

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