Author:
Ambat Rajan,Piotrowska Kamila
Reference34 articles.
1. Investigation of moisture uptake into printed circuit board laminate and solder mask materials;Conseil-Gudla;J. Mater. Sci. Mater. Electron,2017
2. Effects of Moisture Content on Dielectric Constant and Dissipation Factor of Printed Circuit Board Materials;Ma;ECS Trans.,2010
3. Colorimetric visualization of tin corrosion: a method for early stage corrosion detection on printed circuit boards;Verdingovas;Microelectron. Reliab.,2017
4. Circuit analysis to predict humidity related failures in electronics—methodology and recommendations;Joshy;Microelectron. Reliab.,2019
5. Coating Materials for Electronic Applications: Polymers, Processing, Reliability, Testing. Polymers, Processing, Reliability, Testing;Licari,2003
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1 articles.
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