Author:
Eckold P.,Rolff M.,Niewa R.,Hügel W.
Subject
General Materials Science,General Chemical Engineering,General Chemistry
Reference25 articles.
1. Impact of NaCl contamination and climatic conditions on the reliability of printed circuit board assemblies;Verdingovas;IEEE Trans. Device Mater. Reliab.,2014
2. Development of SnAg-based lead free solders in electronics packaging;Zhang;Microelectron. Reliab.,2012
3. The application of surface techniques in understanding corrosion phenomena and mechanisms;Graham;Corros. Sci.,1995
4. P. Eckold, R. Niewa, W. Hügel, Texture of electrodeposited tin layers and its influence on their corrosion behavior, Microelectron. Reliab., in press (2014). DOI: 10.1016/j.microrel.2014.1006.1006.
5. Humidity effects on Sn Whisker formation;Oberndorff;IEEE Trans. Electron. Pack.,2006
Cited by
16 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献